Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Lux Semiconductors' System-on-Foil technology is designed to reduce the size and improve the performance of microelectronics for spacecraft, aircraft and other applications. Credit: Lux Semiconductors ...

WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Non-destructive inspection techniques play a pivotal role in assuring the integrity and performance of microelectronic packages as device architectures become ever more compact and heterogeneous.

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

Jet dispensing has emerged as a pivotal non-contact technique for depositing minute volumes of adhesives, solder pastes and encapsulants in the assembly of microelectronic devices. By propelling fluid ...